MediaTek announces flagship Dimensity 9000 processor built using TSMC’s 4nm process
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MediaTek has announced its flagship Dimensity 9000 processor, the company’s most powerful chipset so far. The Taiwan-based chip maker is looking to compete against the best chips from its competitors like Qualcomm and Samsung.
Here, we will be talking about the specifications and ability of this new 5G chipset from MediaTek.
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MediaTek Dimensity 9000 Overview
MediaTek Dimensity 9000 is the first mobile processor to be built on TSMC’s 4nm process. It is also the first chip to use a Cortex-X2 core clocked at up to 3.05Ghz and include Bluetooth 5.3. Similarly, it is also the first to use ARM’s new v9 architecture and Arm’s new core designs.
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The Dimensity 9000 features an octa-core CPU setup, consisting of 1x Arm Cortex-X2 core clocked at 3GHz, 3x Arm Cortex-A710 cores clocked at 2.85GHz, and 4x efficiency Arm Cortex-A510 cores. The GPU here is a 10-core Arm Mali-G710, along with MediaTek’s fifth-generation APU with six total cores for AI processing, claimed to offer a 20% performance boost over its predecessor.
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The Dimensity 9000 supports LPDDR5x memory at bandwidths of up to 7,500 Mbps. It can also handle screens with up to a 180Hz refresh rate at FHD+ resolutions. In terms of photography, the chip features the new 18-bit image signal processor, which offers the ability to capture 4K HDR video using up to three cameras at the same time. It is also claimed to be the first chip capable of capturing a 320-megapixel image.
The chipset here lacks an integrated modem with mmWave 5G support but instead supports 3CC carrier aggregation for sub-6HZ 5G with top data speeds of up to 7Gbps. Furthermore, the Dimensity 9000 supports WiFi 6E and as mentioned above is the first chip to include Bluetooth 5.3.
MediaTek Dimensity 9000 Specifications
- CPU: 1x Arm Cortex-X2 @ 3GHz, 3x Arm Cortex-A710 @ 2.85GHz, 4x Arm Cortex-A510 @ 1.8GHz
- GPU: Arm Mali Mali-G710 GPU, Raytracing SDK using Vulkan for Android
- Display: max; FHD+ @ 180Hz
- AI: 5th Gen APU, 4x power efficiency over its predecessor
- Memory: LPDDR5X (7500Mbps)
- ISP: 18-bit HDR ISP, 4K HDR video on 3 cameras simultaneously, Super Night Video Recording, 320MP camera support
- Connectivity: Wi-Fi 6E 2×2 (BW160), Bluetooth 5.3
- Manufacturing process: TSMC’s 4nm-class process
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MediaTek Dimensity 9000 Availability
MediaTek Dimensity 9000 SoC-powered smartphones are expected to arrive as early as the first quarter of 2022.
