MediaTek has launched a new 5G chip called the Dimensity 1050. It is targeted toward the mid-range smartphone market and is the first MediaTek chip to feature dual mmWave and sub-6GHz 5G connectivity. So, let’s go through the specifications and ability of this new 5G chipset from MediaTek.
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MediaTek Dimensity 1050 Overview
MediaTek Dimensity 1050 is built using TSMC’s 6nm process. This octa-core CPU features two Arm Cortex-A78 performance cores clocked at 2.5GHz and six Arm Cortex-A55 Efficiency cores clocked at 2.0Ghz.
The CPU is paired with the latest Arm Mali-G610 graphics engine, claimed to deliver great gaming performance and improved efficiency compared to the previous generation Mali GPUs.
As mentioned above, the Dimensity 1050 is the first MediaTek chip to feature dual mmWave and sub-6GHz 5G connectivity. It can connect to both simultaneously, giving up to 53% faster speeds compared to LTE + mmWave aggregation. further, in sub-6GHz exclusive domains, the chip supports the latest 3CC-CA connectivity with speeds of up to 4.6Gbps.
Specifications
- Process: TSMC 6nm
- CPU: 2 x Arm Cortex-A78 @ 2.5GHz, 6 x Arm Cortex-A55 @ 2.0GHz
- GPU: Arm Mali-G610 MC3
- AI: MediaTek APU 550
- Display: Max; FHD+ (2520 x 1080) @ 144Hz
- RAM: LPDDR4X, LPDDR5
- Storage: UFS 2.1, UFS 3.1
- ISP: MediaTek Imagiq 760 ISP, Up to 108MP main camera
- Modem: Integrated multimode 5G/4G modem, mmWave + sub6Hz 5G support
- Connectivity: Bluetooth 5.2, Wi-Fi 6E 2×2
Other features on the Dimensity 1050 include support for an FHD+ display with up to 144Hz refresh rate. Latest global HDR video standards like HDR10+ Adaptive, CUVA HDR-vivid, HLG, and Dolby Vision are also supported by the chip.
MediaTek has also added the Imagiq 760 HDR-ISP which will allow smartphones to capture HDR video on two cameras simultaneously. The chip will support smartphones with up to a 108MP main camera. Paired with the MediaTek APU 550 it will also provide excellent noise reduction for better low light photography.
The chipset gives the options for both LPDDR5 or LPDDR4X RAM and UFS 2.2 or UFS 3.1 storage. Furthermore, the chip supports Bluetooth 5.2, Wi-Fi 6E, and a 2×2 MIMO antenna for faster WiFi.
MediaTek Dimensity 1050 Availability
According to MediaTek, Smartphones with Dimensity 1050 chipsets are will arrive in Q3 2022. We expect OEMs like Xiaomi, Realme, OPPO, and others to announce Dimensity 1050-powered smartphones in the near future.
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