MediaTek announces Dimensity 8000 and 8100 SoC | First smartphones powered by the chip coming in March

 

Mediatek has announced two new high-end smartphones SoCs, named Dimensity 8000 and Dimensity 8100. Both these chips will compete against the Snapdragon 888 processor of Qualcomm, as they all are fabbed on TSMC's 5 nm process. Many smartphones OEMs like Xiaomi, Oppo, and OnePlus have Dimensity 8100 SoC-powered smartphones lined up. The first smartphones powered by the chip are expected to debut in March. So, let’s go through some of the major specs and features of both the MediaTek Dimensity 8000 and 8100 SoCs. 

 

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MediaTek Dimensity 8000 and 8100 SoC Overview

Both Dimensity 8000 and 8100 SoCs are fabbed on TSMC's 5 nm process. The two 8000 chips use four ARM Cortex-A78 big CPU cores and four Cortex-A55 little cores. There’s a Mali-G610 MC6 GPU in both processors as well. 

The difference between the two chipsets comes in their clock speeds. The Dimensity 8000 clocks the Cortex-A78 cores at 2.75 GHz, whereas the Dimensity 8100 boosts that up to 2.85 GHz.  Also, the 8100 SoC offers a 20% higher GPU frequency than the 8000 SoC. According to MediTek, the Dimensity 8100 hits 170 fps in GFXBench Manhattan compared to 140fps on the 8000. 

 

 

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Both the Dimensity 8000 series chips feature the MiraVision 780 and support a 168 Hz refresh rate at FHD+ resolution. Another difference between the two comes in the form of support for  120Hz at WQHD+ resolution on the 8100 SoC. 

The Dimensity 8000 series integrates MediaTek’s fifth-generation AI processing unit, APU 580. Powered by a five gigapixel per second image signal processor (ISP), the Dimensity 8000 series can record HDR video from two cameras simultaneously and 4K 60 fps HDR10+ recording with one. 

Other features on both the Dimensity 8000 and 8100 SoCs are as follow;

• Support for up to 200MP cameras and 4K60 HDR10+ videography.
• MediaTek’s latest noise reduction and AI-based unblur techniques in extreme low-light environments for crisp shots with enhanced details.
• Simultaneous dual-camera HDR video recording. Users can record with the front and rear cameras or two different rear lenses – for example, wide + tele – at the same time.
• Leading 3GPP R16-ready 5G modem to boost sub-6GHz performance using 2CC Carrier Aggregation.
• MediaTek’s 5G UltraSave 2.0 power-saving enhancement suite for improved efficiency.
• Support for Wi-Fi 6E and Bluetooth 5.3 for seamless coexistence of Wi-Fi connectivity and Bluetooth peripherals.

 

 

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MediaTek Dimensity 8000 and 8100 SoC Specifications

	Dimensity 8000	Dimensity 8100
Node	5 nm	5 nm
CPU (big)	4x Cortex-A78 @ 2.75 GHz	4x Cortex-A78 @ 2.85 GHz
CPU (small)	4x Cortex-A55 @ 2.0 GHz	4x Cortex-A55 @ 2.0 GHz
RAM	LPDDR5 (up to 6,400 Mbps)	LPDDR5 (up to 6,400 Mbps)
Storage	UFS 3.1	UFS 3.1
GPU	Mali-G610 MC6	Mali-G610 MC6 (20% faster than 8000)
Display	FHD+ @ 168 Hz	FHD+ @ 168 Hz WQHD+ @ 120 Hz
Camera (stills)	200 MP (5 Gpixel/s IPS)	200 MP (5 Gpixel/s IPS)
Camera (video)	4K @ 60 fps (HDR10+), dual recording	4K @ 60 fps (HDR10+), dual recording
5G	Wi-Fi 6E (2x2)	Wi-Fi 6E (2x2)
Bluetooth	5.3	5.3

 

>>> Qualcomm Unveils Snapdragon 8 Gen 1 Chip | 4x Faster AI Performance

 

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