Along with two high-end smartphones SoCs (Dimensity 8000 and Dimensity 8100), MediaTek also launched a new mid-range Dimensity 1300 chip. It is the successor of the Dimensity 1200 chip and brings improvements to the NPU performance. The first smartphones powered by the chip are expected to debut in March. So, let’s go through some of the major specs and features of MediaTek Dimensity 1300 SoC.
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MediaTek Dimensity 1300 Overview
MediaTek Dimensity 1300 is fabbed on TSMC's 6 nm process. It integrates an octa-core CPU with an ultra-core Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores. The GPU here is an Arm Mali-G77 MC9 and it also features MediaTek APU 3.0 to support the latest AI capabilities.
The Dimensity 1300’s HDR-ISP supports up to 200-megapixel stills. This 5G chip integrates MediaTek’s HyperEngine 5.0 to offer an optimal balance between performance and power for better efficiency in gaming and day-to-day use. Compared to Dimensity 1200, the 1300 SoC brings improvements to the NPU performance, which improves night shot photography and HDR capabilities for better image clarity.
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MediaTek Dimensity 1300 Specifications
- Node: 6nm
- CPU (big): 1x Cortex-A78 @ 3.0 GHz
- CPU (medium): 3x Cortex-A78 @ 2.6 GHz
- CPU (small): 4x Cortex-A55 @ 2.0 GHz
- RAM: LPDDR4X (up to 4,266 Mbps)
- Storage: UFS 3.1
- GPU: ARM Mali-G77 MC9
- Display: FHD+ @ 168 Hz
- Camera (stills): up to 200 MP
- Camera (video): 4K @ 60 fps
- 5G: 4.7 Gbps downlink, 2.5 Gbps uplink
- WiFi: Wi-Fi 6 (a/b/g/n/ac/ax)
- Bluetooth: 5.2
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